JPH0720924Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0720924Y2 JPH0720924Y2 JP2618289U JP2618289U JPH0720924Y2 JP H0720924 Y2 JPH0720924 Y2 JP H0720924Y2 JP 2618289 U JP2618289 U JP 2618289U JP 2618289 U JP2618289 U JP 2618289U JP H0720924 Y2 JPH0720924 Y2 JP H0720924Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- resin
- lead frame
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 71
- 239000000463 material Substances 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 14
- 239000002390 adhesive tape Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2618289U JPH0720924Y2 (ja) | 1989-03-09 | 1989-03-09 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2618289U JPH0720924Y2 (ja) | 1989-03-09 | 1989-03-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02118949U JPH02118949U (en]) | 1990-09-25 |
| JPH0720924Y2 true JPH0720924Y2 (ja) | 1995-05-15 |
Family
ID=31247579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2618289U Expired - Lifetime JPH0720924Y2 (ja) | 1989-03-09 | 1989-03-09 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0720924Y2 (en]) |
-
1989
- 1989-03-09 JP JP2618289U patent/JPH0720924Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02118949U (en]) | 1990-09-25 |
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